3D Microelectronic Packaging : (Record no. 18469)

MARC details
000 -LEADER
fixed length control field 00690cam a22002295i 4500
001 - CONTROL NUMBER
control field 21770749
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20240911061745.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 170125s2017 gw |||| o |||| 0|eng
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9783319830865 (pbk.)
040 ## - CATALOGING SOURCE
Transcribing agency DLC
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Item number LI
245 00 - TITLE STATEMENT
Title 3D Microelectronic Packaging :
Remainder of title From Fundamentals to Applications /
Statement of responsibility, etc. edited by Yan Li and Deepak Goyal.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. Switzerland :
Name of publisher, distributor, etc. Springer,
Date of publication, distribution, etc. c2017.
300 ## - PHYSICAL DESCRIPTION
Extent ix, 463 p. :
Other physical details ill. ;
Dimensions 23 cm.
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes references and index.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Biotechnology.
Topical term or geographic name entry element Electronic circuits.
Topical term or geographic name entry element Electronic materials.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Goyal, Deepak.
Personal name Li, Yan.
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Books
Holdings
Withdrawn status Lost status Damaged status Not for loan Collection Home library Current library Date acquired Source of acquisition Inventory number Total checkouts Full call number Barcode Date last seen Price effective from Koha item type
        Electronics Engineering Reference Collection Reference Collection 11/04/2020 PAK/L 11917167   621.381 LI LC-106131 11/04/2020 11/04/2020 Books
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