3D Microelectronic Packaging :  From Fundamentals to Applications / 
edited by Yan Li and Deepak Goyal. 
 - Switzerland :  Springer,  c2017. 
 - ix, 463 p. :  ill. ;  23 cm. 
<br/><br/>Includes references and index.  
<br/><br/><label>ISBN: </label>9783319830865 (pbk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Biotechnology.<br/>Electronic circuits.<br/>Electronic materials.
<br/><br/><label>Dewey Class. No.: </label>621.381  / LI