TY  - BOOK
AU  - Goyal,Deepak
AU  - Li,Yan
TI  - 3D Microelectronic Packaging: From Fundamentals to Applications 
SN  - 9783319830865 (pbk.)
U1  - 621.381 
PY  - 2017///
CY  - Switzerland
PB  - Springer
KW  - Biotechnology
KW  - Electronic circuits
KW  - Electronic materials
N1  - Includes references and index.
ER  -