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1. Books
3D Microelectronic Packaging : From Fundamentals to Applications / edited by Yan Li and Deepak Goyal. by
Material type: Text Text; Literary form: Not fiction
Publication details: Switzerland : Springer, c2017
Availability: Items available for loan: Reference Collection (1)Call number: 621.381 LI.

2. Books
3D Microelectronic Packaging : From Fundamentals to Applications / edited by Yan Li and Deepak Goyal. by
Publication details: Switzerland : Springer, c2017
Availability: No items available.

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