| 000 | 00690cam a22002295i 4500 | ||
|---|---|---|---|
| 001 | 21770749 | ||
| 005 | 20240911061745.0 | ||
| 008 | 170125s2017 gw |||| o |||| 0|eng | ||
| 020 | _a9783319830865 (pbk.) | ||
| 040 | _cDLC | ||
| 082 | 0 | 4 |
_a621.381 _bLI |
| 245 | 0 | 0 |
_a3D Microelectronic Packaging : _bFrom Fundamentals to Applications / _cedited by Yan Li and Deepak Goyal. |
| 260 |
_aSwitzerland : _bSpringer, _cc2017. |
||
| 300 |
_aix, 463 p. : _bill. ; _c23 cm. |
||
| 504 | _aIncludes references and index. | ||
| 650 | 0 | _aBiotechnology. | |
| 650 | 0 | _aElectronic circuits. | |
| 650 | 0 | _aElectronic materials. | |
| 700 | 1 | _aGoyal, Deepak. | |
| 700 | 1 | _aLi, Yan. | |
| 942 | _cBK | ||
| 999 |
_c18469 _d18469 |
||