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3D Microelectronic Packaging : From Fundamentals to Applications / edited by Yan Li and Deepak Goyal.
Material type:
TextPublication details: Switzerland : Springer, c2017.Description: ix, 463 p. : ill. ; 23 cmISBN: - 9783319830865 (pbk.)
- 621.381 LI
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Reference Collection | Electronics Engineering | 621.381 LI (Browse shelf(Opens below)) | Available | LC-106131 |
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| 621.38043 JOH Introduction to digital signal processing / | 621.381 DE Basic electronics / | 621.381 FLO Electronic devices : conventional current version / | 621.381 LI 3D Microelectronic Packaging : From Fundamentals to Applications / | 621.381 SAH Basic electronics : principles and applications / | 621.381 TOK Digital electronics : principles and applications / | 621.381 WID Digital systems : principles and applications / |
Includes references and index.
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